RF and microwave microelectronics packaging
Ken Kuang
- Publisher
- Springer
- Published
- 2010
- ISBN
- 9781441909831
Microelectronic packaging
Books connected to this subject in the catalog.
Structural Analysis in Microelectronics & Fiber Optics, 1997
Ga.) International Mechanical Engineering Congress and Exposition (1996 : Atlanta
- Publisher
- American Society of Mechanical Engineers
- Published
- June 1997
- ISBN
- 9780791818398
Microelectronic packaging for portable electronics
Sridhar Canumalla
- Publisher
- PennWell
- Published
- 2009
- ISBN
- 9781593701253
![Proceedings of the symposia on Patterning Science and Technology II [and] Interconnection and Contact Metallization for ULSI](https://covers.openlibrary.org/b/isbn/1566770076-M.jpg)
Proceedings of the symposia on Patterning Science and Technology II [and] Interconnection and Contact Metallization for ULSI
International Symposium on Patterning Science and Technology (2nd 1991 Phoenix, Ariz.)
- Publisher
- Electrochemical Society
- Published
- 1992
- ISBN
- 1566770076
Wei mi na mi qi jian feng zhuang ji shu
Yufeng Jin
- Publisher
- Guo fang gong ye chu ban she
- Published
- 2012
- ISBN
- 9787118078961
Area Array Packaging Materials
Ken Gilleo
- Publisher
- McGraw-Hill Professional
- Published
- October 24, 2003
- ISBN
- 9780071428286
Materials for Advanced Packaging
Daniel Lu
- Publisher
- Springer
- Published
- Dec 30, 2016
- ISBN
- 9783319450971
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices VIII
Richard C. Kullberg
- Publisher
- SPIE
- Published
- 2009
- ISBN
- 9780819474520
Materials for Advanced Packaging
Daniel Lu
- Publisher
- Springer
- Published
- Jun 08, 2018
- ISBN
- 9783319832098
Handbook of microelectronics packaging and interconnection technologies
Unknown author
- Publisher
- Electrochemical Publications Limited
- Published
- 1985
- ISBN
- 0901150193
Photonics Packaging And Integration V
Unknown author
- Publisher
- Society of Photo Optical
- Published
- March 30, 2005
- ISBN
- 9780819457059
Photonics packaging, integration, and interconnects IX
A. L. Glebov
- Publisher
- SPIE
- Published
- 2009
- ISBN
- 9780819474674
Introduction to microsystem packaging technology
Yufeng Jin
- Publisher
- CRC Press/Taylor & Francis
- Published
- 2011
- ISBN
- 9781439819104
Structural analysis in microelectronics and fiber optics, 1997
Unknown author
- Publisher
- American Society of Mechanical Engineers
- Published
- 1997
- ISBN
- 079181839X
3D IC stacking technology
Banqiu Wu
- Publisher
- McGraw-Hill Professional
- Published
- 2011
- ISBN
- 9780071741958
RF and Microwave Microelectronics Packaging
Ken Kuang
- Publisher
- Springer London, Limited
- Published
- 2009
- ISBN
- 9781441909848
RF and Microwave Microelectronics Packaging
Ken Kuang
- Publisher
- Springer
- Published
- May 06, 2010
- ISBN
- 9781441909855
RF and Microwave Microelectronics Packaging
Ken Kuang
- Publisher
- Springer
- Published
- 2014
- ISBN
- 9781489983244
Multichip packaging and bare chip systems
Brent J. Knipfer
- Publisher
- Business Communications Co.
- Published
- 1994
- ISBN
- 156965204X
MEMS design, fabrication, characterization, and packaging
Unknown author
- Publisher
- SPIE
- Published
- 2001
- ISBN
- 0819441082
Reliability, packaging, testing, and characterization of MEMS/MOEMS VII
Allyson L. Hartzell
- Publisher
- SPIE
- Published
- 2008
- ISBN
- 9780819470591
Proceedings of the 1992 International Symposium on Microelectronics (Proceedings of S P I E)
Unknown author
- Publisher
- Intl Society of Hybrid
- Published
- October 1992
- ISBN
- 9780930815356
Patterning Science and Technology II and Interconnection and Contact Metallization for Ulsi (Proceedings / Electrochemical Society)
Unknown author
- Publisher
- Electrochemical Society
- Published
- March 1992
- ISBN
- 9781566770071
Components, packaging and manufacturing technology
International Conference on Components, Packaging and Manufacturing Technology (2010 Sanya Shi, China)
- Publisher
- Trans Tech Publications
- Published
- 2011
- ISBN
- 9780878492138
RF and Microwave Microelectronics Packaging II
Ken Kuang
- Publisher
- Springer
- Published
- Jun 09, 2018
- ISBN
- 9783319847191
RF and Microwave Microelectronics Packaging II
Ken Kuang
- Publisher
- Springer
- Published
- Mar 22, 2017
- ISBN
- 9783319516967
2000 International Conference on High-Density Inetconnect and Systems Packaging
Unknown author
- Publisher
- SPIE-International Society for Optical Engine
- Published
- December 2000
- ISBN
- 9780930815608